Chip Quik Inc. Việt Nam | Chip Quik Inc. SMDSWLF.031 1OZ
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Manufacturer
Chip Quik Inc.
Product description
SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Manufacturer Product Number
SMDSWLF.031 1OZ
Detailed description
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 22 SWG Spool, 1 oz (28.35g)
Datasheet
Product Attributes
|
Type | Description |
---|---|---|
Manufacturer | Chip Quik Inc. |
|
Series | - |
|
Package | Spool |
|
Part Status | Active |
|
Type | Wire Solder |
|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
|
Diameter | 0.031" (0.79mm) |
|
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
|
Flux Type | No-Clean, Water Soluble |
|
Wire Gauge | 20 AWG, 22 SWG |
|
Process | Lead Free |
|
Form | Spool, 1 oz (28.35g) |
|
Shelf Life | - |
|
Shelf Life Start | - |
|
Storage/Refrigeration Temperature | - |
|
Environmental and Export Classifications
ATTRIBUTE | DESCRIPTION |
---|---|
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 8311.30.3000 |
For Use With
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